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After a brief introduction to the advantages and method of construction of flip chip solder bond devices, this paper looks at different techniques that can be used to inspect these devices at various stages in their construction. These techniques include optical, infra‐red, acoustic and electron microscopy, radiograph, electrical and tensile testing. The advantages and limitations of each of the techniques are discussed and an outline inspection schedule is suggested.

A measurement tool, capable of monitoring misalignment of layers in multilayer printed circuit boards, is described. Its uses, limitations and its advantages for use in SPC and reliability predictions are highlighted.

This paper looks at the implications of increases in system speed and density for the interconnection system, noting particularly the increased requirements placed on the substrate and tracking system. It reviews the properties required of substrates and the limitations derived from the materials used and the processes needed to put tracks on them. Those areas where these requirements are in conflict are highlighted, including such low technology problems as the limited size availability of substrate prepregs which may limit the tracking density achievable on the newer, more advanced low dielectric materials. Some limitations and trade‐offs are identified.

The problem of providing a reliable and cost‐effective interconnection system between semiconductor devices and other add‐on components and the film circuit has been central to the development of hybrid microelectronic technology since its inception. Many of the techniques used have been adopted from those developed primarily for the semiconductor industry, and not all of these have been entirely suited to hybrid microcircuit production. Thermocompression bonding using gold wire, for example, while acceptable as a process for lead attachment to discrete transistors or semiconductor integrated circuits, in which the duration of exposure to raised temperature is quite short, may be the cause of early or delayed failure when applied to the assembly of a hybrid of any complexity, when the time at temperature is necessarily much longer.

This study describes a peel test to quantitatively measure the adhesion of dry film photoresist on copper. Using this peeling method, the adhesion effects of: (a) the copper surface treatments, (b) the UV radiation of a laminated resist, and (c) the baking of a resist laminated coupon were measured. Adhesive tape with rectangular or wedge‐shaped openings was placed between the photoresist and copper surfaces with the adhesive side facing the resist. The openings in the tape allowed for contact between the copper surface and the resist, and the opening dimensions determined the width and length of contact. With the aid of the adhesive tape, a better grip of the resist was obtained during the peeling. The results of this study led to the following conclusions: A tin‐silane (SNS) treated copper surface with a peeling strength of 4–7 lbs/in. was the most effective surface treatment. A UV radiation dose below or equal to 32 mJ/cm2 produces an adhesion of the resist with micro‐etched copper of 38±03 lbs/in; above this dose, adhesion increases. Thermal baking improves adhesion; the calculated activation energy of a micro‐etched copper surface with the resist is 65 kcal/mole.

The annual Autumn Conference of the British Association for Brazing and Soldering offers a forum for discussions between scientists and engineers involved with two technologies which, because of their obvious similarities, would be expected to be of mutual benefit and learning. In reality both the science and the practice of brazing and soldering are quite different. I suspect, with some regret, the BABS Management Committee decided that for the first time this division be formally recognised by offering soldering as the subject of the first day and brazing and diffusion bonding the subjects of the second. This report covers the soldering day only, during which seven papers were presented:

The purpose of this paper is to identify the major parameters which affect the chances of contamination occurring, and then to evaluate conventional cleaning techniques with respect to these factors. The paper will next describe a new approach to contamination control which minimises the risk of contamination in a cost‐effective manner. In conclusion, some aspects of the circuit board manufacturing process which are particularly sensitive to contamination and which may benefit from the application of ‘Just in Time’ cleaning are described.

A silver‐palladium thick film conductor for aluminum nitride (AlN) substrate has been developed. This conductor film on AlN ceramics had low sheet resistivity, high adhesion strength and good wettability with Pb‐Sn solder. The frit powder of lead borosilicate glass was used as inorganic binders to enhance the adhesion between the conductor and ceramics. After sintering the conductor film connected with the AlN substrate through frit bonding, no transition phases but a multilayer structure is present in the interface. The softening point of the glass was important to the adhesion strength of conductor film. In order to achieve good adhesion, it is necessary that the glass has a proper softening point (about 500‐650°C).

Highly developed and agile learners who can clearly convey and call on their skills are sought in all walks of life. Diverse demand for these capacities has called attention to how the skills and knowledge gained during doctoral study can be conveyed, translated and leveraged in non-academic settings; however, the complex learning reality underneath doctoral development is challenging to convey.

The data set for this particular analysis was obtained from 245 in-depth telephone interviews with PhD candidates collected prior to COVID-19. Candidates were asked about learning processes, challenges and changes, and both the questions and thematic analysis were guided by theories of doctoral development and transformational learning.

For many participants, learning and development were not familiar topics, while a small proportion deflected questions about learning altogether. One fifth of participants presented rich and lucid accounts of learning in which cognisance of complexity, metacognitive processes and transformational experiences were embedded and multiple avenues of development were in evidence. They were well-placed to convey the complexion of doctoral development. Candidates more deeply engaged in learning also commented more about changes they noticed in themselves. The most identified avenue of development was in understanding and approach to knowledge.

Candidate communication about learning and development is an under-explored dimension of doctoral experience and skill that is relevant to advancing knowledge about doctoral development and illuminating graduate potential both within and outside academe. This must constitute a key element of the re-vitalisation of the doctorate post-pandemic. The salience of framing transferable skills within a learning development perspective is discussed.

Key findings from recent and relevant studies on patient safety and clinical handoffs are summarized and analyzed. After briefly reviewing process management and accounting control theory, the aim of this paper is to discuss how these latter two disciplines can be combined to further improve patient safety in handoffs.

A literature review on studies of patient safety, clinical processes and clinical handoffs was conducted in leading medical, quality, and information systems journals.

This paper issues a call for research using a trans‐disciplinary methodology to shed new light on information quality issues in clinical handoff processes, which in turn should improve patient safety.

The literature review employed systematic, heuristic, iterative and practical criteria for identifying and selecting papers, trading off completeness for multi‐disciplinarity. No prior empirical patient safety studies combined process management and accounting control theory.

The above‐noted trans‐disciplinary analytic approach may help medical professionals develop more effective handoff processes, checklists, standard operating procedures (SOPs), clinical pathways, and supporting software, and audit and continuously monitor their implementation.

This paper responds to recent calls for trans‐disciplinary research on healthcare quality improvement. The literature review is valuable for understanding clinical handoff problems and solutions from multiple perspectives. The proposed combination of two theories – accounting control theory and business process management – is novel and useful for describing, improving and monitoring handoff processes in the broader context of clinical processes, using a common terminology for information quality traits.