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The purpose of this paper is to explore how well Chinese teacher education positions itself in preparing qualified teachers for its vast k‐12 education system, especially in the transition from examination‐oriented to that of future‐oriented education.

This paper looks at literature discussing background, strengths and weakness of current Chinese teacher training programs. It also employs the Delphi‐based scenario research method to explore plausible futures of curriculum design for teacher education.

The paper finds that, in order to ensure its astonishing economic development and present itself as a constructive force to the world betterment, it is crucial for China to carry on its ongoing educational reform, especially in the area of curriculum for its teacher training programs. It also concludes that the disciplinary curriculum currently employed in Chinese teacher education should be shifted to the trans‐disciplinary curriculum to produce future‐oriented and internationally‐prepared graduates the country demands in its effort to play an important role on the international stage.

This research, while meriting the structured instruction displayed by the Chinese education system, argues that the system should strive to provide students with such skills as creativity, flexibility, initiative, leadership, all necessary in the globally connected future world. The second part of this paper will focus on four scenarios as a result of his recent research among Chinese educators and administrators.

The purpose of this paper is to explore how well Chinese teacher education positions itself in preparing qualified teachers for its vast K‐12 education system, especially in the transition from examination‐oriented to future‐oriented examination.

The paper looks at literatures discussing background, strengths and weaknesses of current Chinese teacher‐training programs. It also employs a Delphi‐based scenario research method to explore plausible futures of curriculum design for teacher education.

In order to ensure its astonishing economic development and present itself as a constructive force for world betterment, it is crucial for China to carry on its ongoing educational reform, especially in the area of curriculum for its teacher‐training programs.

The disciplinary curriculum currently employed in Chinese teacher education should be shifted to a trans‐disciplinary curriculum to produce future‐oriented, internationally‐prepared, and ICT‐savvy graduates with the high moral standards the country demands in its effort to play an important role on the international stage.

The research, while meriting the structured instruction displayed by the Chinese education system, argues that the system should strive to provide students with such skills as creativity, flexibility, initiative, leadership, all necessary in the globally connected future world. The second part of the paper will focus on four scenarios as a result of recent research among Chinese educators and administrators.

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.

The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.

A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.

The purpose of this paper is to propose a prediction model to predict the cost of complex products with lack of data. The cost estimating is one of the key elements of arguments around technological economy and investment decision‐making process of complex product.

A complex product has many characteristics, such as complex structure, large investment, high risk and it usually falls into small‐batch‐production category. Its cost estimation samples are small and cost data are very limited. Based on the characteristics of complex product and cost estimating, this paper introduces performance parameters sequence of associated known data, establishes an N‐GM (0, N) model of characteristic sequence with straddle missing data.

On the basis of the known key performance parameter sequence, N‐GM (0, N) model is used to predict the grey interval of overall cost vacancy data. Overall cost vacancy data is whitened by sorting reference sequence and realizing complex product overall cost estimation.

The method introduced in the paper can be used to solve practical problems, especially cost prediction of complex products with poor data. The model is also applied on the overall cost and the key component cost estimation of similar but different complex products. Moreover, it provides potential theoretical support for the development of complex product industry in the future.

In this paper, the complex product, which now plays a strategic industrial role in China, is systematically studied by utilizing a new methodology based on grey systems, especially the cost evaluation of the complex product. The use of grey correlation analysis in screening control key item index of complex product cost, the overall cost sequence of the complex product as related sequence and sorting reference sequence, the paper predicts and whitens vacant key item index, obtaining the key item cost index of complex product.