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Tape automated bonding (TAB) is an interconnection technique for integrated circuits (ICs) with a small lead pitch and a thin assembly thickness. During inner lead bonding the flying (Au plated Cu) leads of the TAB foil are connected to the Au bumps on the bondpads of an IC. The Au bumps are deposited in the openings of a thick Novolac based resist layer by electroplating. The resist is coated on a sputtered TiW‐Au metallisation; TiW is the barrier layer between Au bump and Al bondpad. Bonding of the leads to the Au bumps requires substantial plastic deformation of the bump and lead. As a result of this deformation, the TiW barrier layer underneath the bump may crack easily. A theoretical model has been used to describe the occurrence of these cracks. This theoretical model is compared with experimental results of deformation and cracking behaviour by visual inspection of the TiW barrier and the etched cross‐sections. Separate (single point) and simultaneous (gang) bonding techniques, different gold plating baths and TAB tapes are used to study the cracking behaviour.

This event, the first sponsored by ISHM, takes place in Pardubice on the 19–20 November 1991. Pardubice is a town of some 100,000 inhabitants about 60 miles east of Prague. A welcome is extended to all ISHM Chapter members.

Flip chip solder joint reliability under thermal shock stress was investigated both experimentally and by 2D finite element simulation. The results indicate that solder fatigue is the dominant failure mode and that delamination has obvious adverse effects on the solder joint lifetime. Different material/process combinations (underfill, flux, reflow atmospheres) were designed in order to understand the role of material/process factors on the solder joint lifetime and the results are discussed.

Flip chip on board (FCOB) solder joint reliability under thermal shock stress was investigated. With underfill materials, the solder joint lifetime was increased from 37 to 1,300/2,480 cycles depending on the particular underfill material used. Through the use of CSAM, SEM, dye penetration tests and cross sectioning, the reliability of a FCOB assembly under thermal shock stress was evaluated. Both dye penetration and SEM fracture analysis can be used to measure quantitatively the extent of crack propagation for assemblies without underfill. A new failure mechanism, PCB cracking was also observed and discussed.

The dry development of a photoresist is modelled using the analytical solution of the Boltzmann equation. It is proposed that at very low pressure and in the presence of a magnetic field, the etch rate of the resist can be calculated by integrating the ion flux. The simulation results illustrates improvement in both microuniformity and macrouniformity when the resist is etched under these process conditions.

ISHM‐Benelux has recently set up a permanent secretariat at the following address:

The purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging.

This paper gives a thorough review of stencil printing for electronic packaging including the current state of the art.

This article explains the different stencil technologies and printing materials. It then examines the various factors that determine the outcome of a successful printing process, including printing parameters, materials, apparatus and squeegees. Relevant technical innovations in the art of stencil printing for microelectronics packaging are examined as each part of the printing process is explained.

Stencil printing is currently the cheapest and highest throughput technique to create the mechanical and electrically conductive connections between substrates, bare die, packaged chips and discrete components. As a result, this process is used extensively in the electronic packaging industry and therefore such a review paper should be of interest to a large selection of the electronics interconnect and assembly community.

Reports on a study for which data were generated from responses to a survey by 132 US apparel manufacturers in 1993. States that the purpose of the study was to determine the extent to which companies were investing in ergonomic equipment as a prevention strategy, and whether there was a relationship between such investments and positive results in four areas: increased productivity, increased quality, decreased workers’ compensation costs and improved employee morale. Using chi‐square analysis, a significant difference was found for those who invested in automatic sewing equipment in both increased productivity and increased quality. Provides justification for companies to invest in ergonomic equipment because of additional benefits.

Investigates the relationship between print advertisement wording and consumer interest in relation to cell phone promotion. Reports on an experiment involving two independent variables: message framing and felt involvement levels. Shows how these variables interact regarding attitudes towards cell phones for a New Zealand sample. These findings provide new insights as well as support for previous empirical research. Discusses theoretical and managerial implications and directions for future research.