Microelectronics International: Volume 41 Issue 1

A high performance RC-INV triggering SCR under 0.25 µm process

Xuebing Su, Yang Wang, Xiangliang Jin, Hongjiao Yang, Yuye Zhang, Shuaikang Yang, Bo Yu

As it is known, the electrostatic discharge (ESD) protection design of integrated circuit is very important, among which the silicon controlled rectifier (SCR) is one of the most…

Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints

Xing Gao, Z.J. Zhang, Hong Wei, Xu Zhou, Quan Shi, Yang Wu, Lei Da Chen

Solder bumps for chip interconnections are downsizing from current approximately 100 µm to the expected 1 µm in future. As a result, the Cu-Ni cross-interaction in Cu/Solder/Ni…

Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signals

Yokesh V., Gulam Nabi Alsath, Malathi Kanagasabai

The design, fabrication and experimental validation of defected microstrip structure (DMS) are proposed to address the problem of near-end crosstalk (NEXT) and far-end crosstalk…

A novel S-shaped frequency and pattern reconfigurable patch antenna for 4G LTE, WLAN/Wi-Max application

Pallav Rawal, Sanyog Rawat

In wireless communication system, use of multiple antennas for different requirements of system will increase the system complexity. However, reconfigurable antenna is maximizing…

Magnetic alignment technology for wafer bonding

Lezhi Ye, Xuanjie Song, Chang Yue

Wafer bonding is a key process for 3 D advanced packaging of integrated circuits. It requires very high accuracy for the wafer alignment. To solve the problems of large movement…

Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering

Y. Wu, Z.J. Zhang, L.D. Chen, X. Zhou

Laser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature…

Structural analysis of paper substrate for flexible microfluidics device application

Supriya Yadav, Kulwant Singh, Anmol Gupta, Mahesh Kumar, Niti Nipun Sharma, Jamil Akhtar

The purpose of this paper is to predict a suitable paper substrate which has high capillary pressure with the tendency of subsequent fluid wrenching in onward direction for the…