Microelectronics International: Volume 38 Issue 4

A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata

Wenhua Huang, Juan Ren, Jinglong Jiang, J. Cheng

Quantum-dot Cellular Automata (QCA) is a new nano-scale transistor-less computing model. To address the scaling limitations of complementary-metal-oxide-semiconductor technology…

An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations

Muhammad Ahmad Raza Tahir, Muhammad Mubasher Saleem, Syed Ali Raza Bukhari, Amir Hamza, Rana Iqtidar Shakoor

This paper aims to present an efficient design approach for the micro electromechanical systems (MEMS) accelerometers considering design parameters affecting the long-term…

Computer‐aided selective production of low-resistance NiP and NiCuP layers

Piotr Kowalik, Edyta Wróbel

This paper aims to present the possibility of computer-aided technology of chemical metallization for the production of electrodes and resistors based on Ni-P and Ni-Cu-P layers.

Preliminary dielectrophoresis study: Manipulation of protein albumin and electrical quantification by using cyclic voltammetry technique

Nur Shahira Abdul Nasir, Revathy Deivasigamani, Muhammad Khairulanwar Abdul Rahim, Siti Nur Ashakirin Mohd Nashruddin, Azrul Azlan Hamzah, M. Farhanulhakim M. Razip Wee, Muhamad Ramdzan Buyong

The purpose of this paper is to visualize protein manipulation using dielectrophoresis (DEP) as a substantial perspective on being an effective protein analysis and biosensor…

Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach

Mohammad Hafifi Hafiz Ishak, Mohd Sharizal Abdul Aziz, Farzad Ismail, M.Z. Abdullah

The purpose of this paper is to present the experimental and simulation studies on the influence of copper pillar bump structure on flip chip packaging during reflow soldering.

Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Chong Hooi Lim, Mohd Zulkifly Abdullah, Ishak Abdul Aziz, Chu Yee Khor, Mohd Sharizal Abdul Aziz

This study aims to investigate the interaction of independent variables [Reynolds number (Re), thermal power and the number of ball grid array (BGA) packages] and the relation of…

On the methodology of calculating volume charge density in a MIFGMOS substrate using Poisson’s equation

Francisco Javier Plascencia Jauregui, Agustín Santiago Medina Vazquez, Edwin Christian Becerra Alvarez, José Manuel Arce Zavala, Sandra Fabiola Flores Ruiz

This study aims to present a mathematical method based on Poisson’s equation to calculate the voltage and volume charge density formed in the substrate under the floating gate…