Microelectronics International: Volume 37 Issue 1

Implementation of phosphor sedimentation to reduce thermal instability issue affecting white LED luminescence

Hui Yuen Peng, Fong Kwong Yam

In general, lighting application, white light emitting diode (LED) usually exposed to an extreme operating temperature of above 90°C. It is well-known that luminous efficacy and…

Design of microfluidic experimental setup for the detection of heavy metal ions using piezoresistive BioMEMS sensor

Dinesh Ramkrushna Rotake, Anand D. Darji, Nitin S. Kale

This paper aims to propose a new microfluidic portable experimental platform for quick detection of heavy metal ions (HMIs) in picomolar range. The experimental setup uses a…

Design, fabrication and characterization of LTCC micro-hotplates for gas-sensing application

Lokesh Kulhari, Achu Chandran, Kanad Ray, P.K. Khanna

Low temperature co-fired ceramics (LTCC) technology-based micro-hotplates are of immense interest owing to their ruggedness, high temperature stability and reliability. The…

Intermetallic growth kinetics in gold ball bonds on Al-1%Si-0.5%Cu bond pads at 175∘C

Christopher Breach

The purpose of this study is to demonstrate that isothermal intermetallic growth data for gold ball bonds can be non-parabolic with explanations of why deviation from parabolic…

Crystal orientation dependence of alternating current photo-assisted (ACPEC) porous silicon for potential optoelectronic application

Alhan Farhanah Abd Rahim, Aida Azrenda Mustakim, Nurul Syuhadah Mohd Razali, Ainorkhilah Mahmood, Rosfariza Radzali, Ahmad Sabirin Zoolfakar, Yusnita Mohd Ali

Porous silicon (PS) was successfully fabricated using an alternating current photo-assisted electrochemical etching (ACPEC) technique. This study aims to compare the effect of…

Effect of adhesive force on underfill process based on lattice Boltzmann method

M.H.H. Ishak, Farzad Ismail, Mohd Sharizal Abdul Aziz, M.Z. Abdullah

The purpose of this study is to investigate the effect of the adhesive force and density ratio using lattice Boltzmann method (LBM) during underfill process.