Table of contents
Numerical analysis of PBG via structures using FDTD algorithm
Ming‐Sze Tong, Yinchao Chen, Yilong Lu, Hyeong‐Seok Kim, Tae‐Gyu Chang, Ronan SauleauTo study the photonic band‐gap (PBG) characteristics constructed by periodic conducting vias on various guided transmission‐line structures.
Low voltage high performance CCII for analog signal processing applications
S.S. Rajput, S.S. JamuarTo provide new structures and applications of CCII for analog signal processing.
Silicon‐on‐insulator lateral dual sidewall Schottky (SOI‐LDSS) concept for improved rectifier performance: a two‐dimensional simulation study
M. Jagadesh Kumar, C. Linga ReddyTo develop a silicon lateral Schottky rectifier with low forward voltage drop and low reverse leakage current while its breakdown voltage is significantly larger than that of a…
Thermal analysis of LED package
N. Aizar Abdul Karim, P.A. Aswatha Narayana, K.N. SeetharamuTo demonstrate thermal modeling technique for a through hole light emitting diode (LED) package using a commercial computational fluid dynamic (CFD) code and to improve its…
Width optimization of global inductive VLSI interconnects
Brajesh Kumar Kaushik, S. Sarkar, R.P. AgarwalThe performance of a high‐speed chip is highly dependent on the interconnects, which connect different macro cells within a VLSI chip. Delay, power dissipation and cross‐talk are…
ISSN:
1356-5362e-ISSN:
1758-812XISSN-L:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson