Table of contents
New Compositions for Hybrid Circuits
R. Kužel, J. BroukalNew resistor compositions prepared by using special kinds of glass, CdO, RuO2 and Nb2O5, have been developed. This system is typical in containing only a small amount of RuO2…
Large Substrate Thick Film Printing and Handling
C. PhippardOutput rates with multicircuit printing techniques on different sizes of substrate are examined. Hand load/unload is then compared with the autofeed systems now becoming available…
Thermal Problems in Micro Assemblies
B. LacrucheExcept in specific activities in electronic equipment, thermal management is not the most exciting subject for those involved in design. With micro‐assembly (surface mounting of…
Plasma Treatment in Hybrid and Conventional Electronic Assemblies
R.N. Booth, P.E. OngleyPlasma chemistry is employed almost exclusively for etching, cleaning and deposition processes in semiconductor device fabrication technology. As a natural expansion of this…
Ruthenium Contacts Resist Chemical Attack in Communications Use
R.D. Lanam, A.R. RobertsonIn general, sputtered ruthenium films attain platinum‐group properties that make them candidates for various uses in electrical, thermal and decorative areas. Advanced…
Wire Bonding as a Technique for Semiconductor Device Assembly
A.D. WestonThis paper is aimed at Engineers involved in production wire‐bonding processes and system maintenance. It traces the development of microbonding from its origins to the present…
The Fundamentals of Thin Film Resistive Technology for the Production of Ultra‐stable Resistors and Networks
P.R. SimonThe paper describes the physical phenomena which influence the electrical and mechanical characteristics of low temperature coefficient, high stability thin metal resistive films…
New Thick Film Temperature Sensor of Exhaust Valves in Fiat 126P
J.J. Gondek, T.H. Wojewódzki, A. MajowiczThis paper presents the results of preliminary research carried out in the Department of Microelectronics at the Institute of Electronics of the Mining and Metallurgical…
Present and Future Applications for Laser Processing of Hybrids and Semiconductors
E.J. SwensonPresent and future development of laser processing as a production technique for modifying semiconductor devices, improving yields, and decreasing development times are described…
Quality Control in Ultrasonic Wire Bonding
R. Rodwell, D.A. WorrallThis paper reviews methods of quality control for the ultrasonic wire bonding process. It also covers the basic principles of the process, a model for the bonding mechanism, and…
ISHM news
Peter MoranA two‐day symposium will be hosted by the ISHM‐Can‐Am Chapter in Ottawa, Canada, on 19–20 June 1985. The event will concentrate on advances in Surface Mounted Technology and…
Industry news
Anicon, Inc. have recently appointed Friedrich Weiler as Managing Director, Anicon Europa, GmbH, and have announced the opening of Anicon's European headquarters facility in…
New products
The latest Laser Trimmer from Chicago Laser Systems, designated the CLS37S, is said by the manufacturers to offer the best of both worlds. With a DIP network throughput of 70…
ISSN:
1356-5362e-ISSN:
1758-812XISSN-L:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson