Table of contents
Interconnection Technology for Advanced High Density Thick Films
M. Vrana, A. Van Calster, R. Vanden Berghe**, K. AllaertThick film screen printing technology is able to reach apitch of 250 μm. In an attempt to achieve lower values, two approaches have been developed so far. Both are based on the…
Fine‐line Passive Components for Hybrid Microelectronics
V. Kripesh, S.K. Bhatnagar, H. Osterwinter, W. GustA laser ablation technique has been used to fabricate conductor patterns on a 96%alumina substrate to evolve passive fine‐line components and structures. This paper reports the…
Application of Taguchi Methods to the Production of Integrated Circuits
I.E. KleinTaguchi methods were applied to theproduction of thin RF integrated circuits on alumina. The substrates had 20 via holes of 1 mm indiameter, which led to a perturbation to the…
An Ultra High Density Technology for Microsystems
S. Larcombe, P. IveyThis research demonstrates how a low‐cost three‐dimensional packaging technology can be ultilised to implement heterogeneous microsystems. Systems which integrate sensors…
Advances in Packaging and Assembly Polymers
K. GilleoThe Packaging Revolution of the ’90s, powered by the perpetual drive for smaller‐faster‐cheaper products, is placing increasing demands on the electronic materials sector…
Packaging Reliability for High Temperature Electronics: A Materials Focus
F.P. McCluskey, L. Condra, T. Torri, J. FinkAn overview of the concerns involved in the operation of electronic hardware at elevated temperaturesis presented. Materials selection and package design issues are addressed for…
Synergistic Combinations of Thermally Conductive Fillers in Polymer Matrices
R. CrossThe use of thermally conductive adhesives tobond heat generating devices to heat sinks is an alternative production method for thermalmanagement. It is of interest to be able…
Spin Coating Study for Thick Layers with High Viscosity Polyimide
M. Borsetto, G. Carcano, M. CerianiPolyimide deposition of thick layers (50‐60 μm aftersoft‐bake) is very important in the field of microelectronics; in particular for fabrication of microwavecircuits for…
ISSN:
1356-5362e-ISSN:
1758-812XISSN-L:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson