Microelectronics International: Volume 12 Issue 3

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Hybrid Technology

Professor H. Binner

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Piezoelectric Thick-film Materials and Sensors

M. Prudenziati, B. Morten, G. De Cicco

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143

Planar Thick Film Integrated LCV Cells

O.S. Aleksić, P.M. Nikolić, M.D. Luković, D. Vasiljević-Radović

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Electrical Design Techniques for MCM-D

D.B. Tuckerman, D. Benson

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Low Cost, Thick Film Resistive Compositions without the Use of Noble Metals

S. Achmatowicz, M. Jakubowska, E. Zwierkowska, M. Primovitch

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Microelectronics Markets in Europe

N. Sinnadurai

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High Performance Material Technologies for Advanced Circuit Assemblies and MCMs

P. Barnwell, G. Shorthouse

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A Novel Composite Material for Electronic Packaging

J.-M. Ting, M.L. Lake

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Fine Pitch Wire Bonding for µBGA™ Packages

Z. Kovac, T.H. DiStefano, J. Grange, I. Alfonso

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ISSN:

1356-5362

e-ISSN:

1758-812X

ISSN-L:

1356-5362

Online date, start – end:

1982

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

Professor John Atkinson

Microelectronics International: Volume 12 Issue 3

Table of contents

Hybrid Technology

Piezoelectric Thick-film Materials and Sensors

Planar Thick Film Integrated LCV Cells

Electrical Design Techniques for MCM-D

Low Cost, Thick Film Resistive Compositions without the Use of Noble Metals

Microelectronics Markets in Europe

High Performance Material Technologies for Advanced Circuit Assemblies and MCMs

A Novel Composite Material for Electronic Packaging

Fine Pitch Wire Bonding for µBGA™ Packages

ISSN:

e-ISSN:

ISSN-L:

Online date, start – end:

Copyright Holder:

Open Access:

Editor:

Further Information

Table of contents

ISSN:

e-ISSN:

ISSN-L:

Online date, start – end:

Copyright Holder:

Open Access:

Editor:

Further Information

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