Table of contents
UV laser cutting of glass-epoxy material for opening flexible areas of rigid-flex PCB
Shouxu Wang, Li Feng, Yuanming Chen, Wei He, Zhihua Tao, Shijing Chen, Huan XuThe purpose of this paper is to form good cutting qualities in glass-epoxy material for opening flexible areas of rigid-flex printed circuit boards (PCB) by ultraviolet (UV) laser…
534
Factors governing filling of blind via and through hole in electroplating
Jing Wang, Miao Wu, Chengqiang CuiThe purpose of this paper is to present a clear picture of the key factors of blind via and through hole filling in electroplating, e.g. shape of via or hole, electroplating…
1198
Influence of thermal deformation of drilling machine on hole registration accuracy
Haitian Zou, Baolin WangThe purpose of this study was to investigate the thermal deformation effect of a machine tool frame on hole registration accuracy. Hole registration accuracy represents the…
464
Distance context based PCB film image alignment
Chengyong Zheng, Hong Li, Guokuan LiThis paper presents a novel printed circuit board (PCB) film image alignment method based on distance context of image components, which can be directly used for PCB film…
132
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari