Table of contents
Measurement of simulated active device and RF trace heating in high frequency circuit laminates
Christopher J. Caisse, John Coonrod, Allen F. HornThe purpose of this paper is to quantify the effects of thermal conductivity (TC), dielectric constant and dissipation factor (DF) of circuit laminates on the temperature rise…
271
The elimination of whiskers from electroplated tin
George MiladThe purpose of this paper is to present new developments in electrolytic tin plating designed to eliminate the formation of whiskers over time, when tin is plated on copper.
247
Boric acid in PCBs: compliance with EU REACH regulations
Michael J. Mullins, David K. Luttrull, Hans SchumacherBoric acid has been used for many years as a catalyst inhibitor and crosslinking agent to increase the glass transition temperature of epoxy resins for printed circuit boards…
243
Laser microvia formation in polyimide thin films for metallization applications
Brent RoegerThe purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible…
565
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari