Table of contents
Halogen‐free materials with improved thermal and electrical properties
David Bedner, Michael HeThe purpose of this paper is to present a latest update on halogen‐free base materials that are lead‐free compatible and have enhanced electrical properties.
EnFACE: a maskless process for circuit fabrication
Sudipta RoyThe purpose of the paper is to present an update and the latest results from work on a project which could be useful for maskless printed circuit board (PCB) manufacturing.
Microfluidic systems on a printed wiring board platform
Keryn Lian, Shawn O'Rourke, Daniel Sadler, Claudia Gamboa, Robert Terbrueggen, Marc ChasonThe purpose of this paper is to present the development of printed wiring board (PWB)‐based microfluidic building blocks and their integration into systems for DNA amplification…
The processing time optimization of printed circuit board
Mircea AncăuThe purpose of this paper is to demonstrate the optimization of printed circuit board (PCB) manufacturing by improving drilling process productivity.
Method and system of automated measurement of micro drill bit wear
Lianyu Fu, Jian Li, Fan YangThe purpose of this paper is to provide a method and system to achieve automated measurement of micro drill bit wear.
Influences on the reflow soldering process by components with specific thermal properties
Florian Schüßler, Denis Kozic, Jörg FrankeThe purpose of the paper is to focus on the research into components with specific thermal properties and their influences on the reflow soldering process.
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari