Table of contents
Integrated waveguides for optical interconnects
Denis Sweatman, Olly Powell, Shinoj FrancisTo detail results of research into optical waveguides fabricated from silicon on insulator (SOI) for on‐chip high speed applications and from polymer for more general applications.
Halogen‐free laminates: worldwide trends, driving forces and current status
Jérôme De Boysère, Adrian BeardTo give an overview about market trends and driving forces of halogen‐free materials for PCB applications. The paper also includes an overview about new halogen‐free raw materials…
Evolution of a wiring concept – 30 years of flex‐rigid circuit board production
Markus WilleSeeks to answer the question: have the reasons for using flex‐rigid circuit boards changed through the years?
De‐mystifying materials selection for lead‐free soldering
Casper Chen, Joshua Chiang, F.Y. LeeThe lead‐free soldering process has been confounding the PWB fabricators when they set out to select the right materials for lead‐free soldering. This paper discusses the…
Occupational exposure and environmental emissions related to nickel plating: a sample of the UK nickel plating sector
Wouter Ghyoot, Rebecca Green, Bryan FisherMetallic nickel and four nickel compounds are undergoing a risk assessment in the European Union. The outcomes of this risk assessment may be used for a revision of existing or…
Dual metal core multilayer boards (MLBS) – a better option for high speed spacecraft electronic packaging applications
C. Hanumanth Rao, Jissy Varghese, A. Suresh, B.N. BaligaRealising a solution for effective thermal management for high‐speed electronic packaging for spacecraft applications through dual metal core MLBs.
Stress analysis for fracturing potential of blind via in a build‐up substrate
Tong Hong Wang, Yi‐Shao LaiThe submodeling technique is incorporated in a finite element analysis to investigate the stress state of blind vias of different structural configurations.
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari