Table of contents
An overview of digital printing for advanced interconnect applications
Thomas SutterTo review the concept of digital imaging for PCB manufacturing, with a specific focus on ink‐jet printing technologies.
A software tool for estimation of PCB substrate utilisation efficiency statistics from scanned images
S.M. Hyslop, P.J. Palmer, D.C. WhalleyRouting efficiency provides an estimate of the compactness of a specific PCB layout in comparison with the theoretical minimum size for the circuit design. This work describes a…
SAVIA, an advanced multi‐layer parallel lamination technique for high density, high performance printed circuit boards
Taehoon Kim, Jee‐Soo Mok, Chang‐Kyu Song, Jun‐Heyoung Park, Kyung‐O Kim, Ben Sun, Byung‐Youl MinTo review a newly developed PCB fabrication process based on a parallel lamination technique.
New technologies for a sustainable printed circuit board manufacturing process: initial results
Narinder Bains, Kate Geraghty, Martin GooseyTo present the initial results from a project recently undertaken by Rohm and Haas Electronic Materials Europe Ltd, in collaboration with a number of European partners, to develop…
Environmental and economic implications of a shift to halogen‐free printed wiring boards
Carl Gunnar Bergendahl, Kerstin Lichtenvort, Glenn Johansson, Mats Zackrisson, Jonna NyyssönenTo present the outcome from one case study in the EU project grEEEn (Cost Management System for greening Electrical and Electronic Equipment). The study addressed the material…
Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys
Dezhi Li, Changqing Liu, Paul P. ConwayTo study the influence of storage time and environment on the solderability of electroless nickel plated samples with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solders and to provide…
Soldering considerations for lead‐free printed circuit board assembly – an Envirowise Guide
Martin GooseyTo give an overview of the issues encountered, and changes that need to be made in the various types of soldering process when converting them from conventional to lead‐free…
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari