Table of contents
High frequency PCB base materials – a comparison of thermomechanical properties
Sylvia EhrlerThere is increasing customer demand for materials with low dissipation factors for reduced loss along the traces and low dielectric constants for higher signal propagation speeds…
High performance epoxy copper clad laminate
Fang KehongIn recent years, with the development trends towards lighter, shorter and smaller high performance and high reliability electronic products, printed circuit boards have…
High‐performance substrate from new epoxy resin and enhanced copper foil
Ludovic Valette, Rudolf WiechmannThe Dow Chemical Company has developed a new epoxy‐based system to serve the growing need for high‐performance dielectric substrates, requiring high thermal reliability (high Tg…
An innovative “ChemicalVia” process for the production of high density interconnect printed circuit boards
Vitor da Silva, Rui de Oliveira, David Watts, Erik van der BijThe ChemicalVia process, patented by CERN, provides a new method of making microvias in high‐density multilayer printed circuit boards of different types, such as sequential…
An introduction to high performance laminates and the importance of using optimised chemical processes in PCB fabrication
Martin Goosey, Mark PooleWith the ever increasing demands for high performance electronic devices there is a need for circuit board laminates that have enhanced properties when compared to conventional…
A novel method for sequentially‐building multi‐layer circuits using LCP laminates, cap‐layers and bond plys
Cliff RoseenDevelopment efforts at Rogers are continuing on R/flex® liquid crystalline polymer (LCP) materials for printed circuit production. As an extension of our EIPC Spring 2003 paper…
PCB drillability: a material science approach to resin development
Nikhil VergheseIn the manufacturing process for making printed circuit boards (PCB) it is necessary to drill holes in the base copper clad laminate. This is a crucial step in the case of…
What share of the global upturn can Europe retain?
Hans J. FriedrichkeitThis paper views the economic situation for electronic component manufacturers worldwide, focusing particularly on those in Europe. It notes that recovery will proceed at a…
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari