Circuit World: Volume 30 Issue 1

Trimming embedded resistors: an enabling technology

Focuses on embedded passives (EPs), an emerging technology for the PCB industry, which shows potential for reductions in board area (or increased functionality in a given fixed…

Thin‐film embedded resistor and capacitor technologies

Printed circuit board designers face formidable challenges of increased functionality in smaller size boards, and reduced EMI in high‐speed circuits. Embedded passives technology…

Matching embedded capacitor dielectrics to applications

All capacitor dielectric materials, whether used for discrete or embedded applications, can be grouped into two general categories: paraelectric and ferroelectric. Ferroelectrics…

Cost and production analysis for substrates with embedded passives

With the advent of new materials and technologies that enable passive components to be embedded within electronic substrates, one key question that arises is: under what…

Process development for PWB compatible embedded capacitors

This paper addresses materials and processes for printed wiring board compatible embedded capacitors using polymer/ceramic nanocomposites and hydrothermal barium titanate…

New non‐reinforced substrates for use as embedded capacitors

As CPUs increase in performance, the number of passive components on the surface of circuit boards also increases dramatically. To reduce the number of components, as well as…

Status and trends for PWBs with embedded components

Increasing packaging density and the requirement for high performance electronic devices are driving high density interconnect (HDI) printed wiring board (PWB) technology towards…

Contamination testers help eliminate cost of rework, repair and field failure

"Changing circumstances – new possibilities", The EIPC Spring Conference 2003

IPC/Soldertec Conference on lead-free electronics – an international success!

IPC, HKPCA Reschedule International Exhibition

First in series of NPL Lead-Free Master Classes is well received

Victory for US PCB industry officially decreed

Embedded passives

Simm Technology secures 3mln USD order from UK's Graphic

Awards for Excellence

Circuit world to acquire Firan Technology Group

A brief introduction to IPPC and what it will mean to the PCB industry

Soldertec opens its doors and widens its horizons

An interview with Klaus Dittrich, Managing Director of Messe München GmbH

New laser trimmer reduces total trim/test time by up to 50 per cent

FlexLink's new Genesis F1300

ICT Annual Symposium 2003 – "Navigating the Technology Network"

NPL ensure success of the "Hands-On Lead-Free Experience" at Nepcon show

IPC releases book- to-bill ratio and business report for May 2003

International diary

Nepcon to return to Brighton in 2004

Brian Ellis wins the Outstanding Service Award at the Literati Awards for Excellence 2003

Dalian Pacific Electronics to build largest and most-advanced PCB plant in China

Sustainable Technology for tin etch resist stripping solutions

EIPC Winter Conference

Enthone España receives OHSAS 18001 certification

Erik J. Bergum appointed VP Sales, Polyclad Europe

Internet commentary

"Supply Line Importance"

Integrated Passive Component Technology

Lloyd Doyle unveil 6000 HDI