Table of contents
New halogen‐free materials for PWB, HDI and advanced package substrate
Hikari Murai, Yoshiyuki Takeda, Nozomu Takano, Ken IkedaRecently, the requirement of the printed wiring boards (PWBs) of environmental harmony type has risen rapidly. We have developed the core technologies of halogen‐free. They…
323
Development of a new, more efficient and environmentally friendly method of producing high density interconnects – the “PRIME” process
David Albin, Jean‐Claude Rames, Claudia Dietel, Kai Lenfert, Stephanie Rossi, David Starkey, Joel Down, Ricard Pineda, Juan Carlos Sardon, Martin Goosey, John Graves, Narinder Bains, Frank Cristoph, Frank Smeets, Willy GilenIn September 1998 six European companies involved in PCB manufacturing and electronic packaging started collaborating in a development project known as “PRIME”. The “Program for…
259
Minimization of tin whisker formation for lead‐free electronics finishing
Rob SchettyMany theories regarding whisker growth exist. It has been demonstrated in a variety of reference sources that tin whiskers can form in both pure tin and tin alloy deposits…
764
1328
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari