Table of contents
Encapsulant materials systems for flip‐chip‐on‐board assemblies: addressing manufacturing issues
Daniel R. Gamota, Cindy M. MeltonEncapsulant materials for flip‐chip‐on‐board (FCOB) were developed to address issues that have been observed during assembly of consumer electronic products on a high volume…
Conformal coating removal techniques
Hal HorrocksSummarizes the different techniques for the removal of conformal coatings from printed circuit boards and other electronic assemblies. Addresses each of the four techniques for…
Flat panel displays – what is going on in East Asia outside Japan
Michael Pecht, Chung‐Shing LeeSummarizes the flat panel display (FPD) industry outside of Japan, with a focus on advances in Korea and Taiwan. Discusses the major manufacturers in each country as well as their…
Development of axial laminographic system for electronic packaging inspection
Young‐Bin Cho, Dae‐Gab Gweon, Han J. Yun, Kyung R. LeeX‐ray laminographic image can provide more useful information about the internal state of electronic packaging than x‐ray radiographic image does. Many kinds of laminographic…
UV curable conformal coatings and peelable masks which display enhanced fluorescent response
Stephen E. CantorDescribes the use of a new type of UV cured coating and adhesive which are not adversely affected by fluorescing agents, so that increased quantities of fluorescing agents can be…
A low‐cost chip size package – NuCSP
T. Chou, J. LauPresents a new wire bondable land grid array (LGA) chip scale package called NuCSP. NuCSP is a minimized body size wire bondable package with rigid substrate interposer. The…
Solder bridging test to evaluate the compatibility for fine‐pitch microsoldering
Tadashi Takemoto, Tatsuya Funaki, Makoto Miyazaki, Akira MatsunawaEstablishes a quantitative evaluation method on solder bridging in microsoldering using a printed wiring board with comb pattern conductors. Bridge tests were conducted by…
Laser drilling of blind holes in FR4/glass
M. Owen, E. Roelants, J. Van PuymbroeckIn the last two years, laser drilled microvias have become the dominant method for producing blind vias smaller than 150 mm, with over 100 laser drilling machines with a variety…
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari