Table of contents
AK‐255 as a Drop‐in Replacement for CFC‐113 and HCFC‐141B
J.H. Cumbest, G.R. UnruhCFCs and HCFCs have been used extensively in bulk cleaning of computer boards and are included in well established branch of chemistry. Due to the removal ofone such CFC…
Discrete Wiring: A Systems Approach To High Speed Design Problems
T.J. BuckIncreasing speedscombined with the level of integration that can be obtained with advanced IC technology hasdramatically changed the interconnection requirements for high…
Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages
S.‐W. Lee, J.H. LauThis paper presents a non‐linear numerical study to investigate the effectof chip dimension and substrate thickness on the solder joint reliability of plastic ball grid…
Comparison of Methods for Characterising Soldering Fluxes and their Interactions with Substrates and Metallisation
L.J. TurbiniThe 1980s and 1990s have seen the development of new andinteresting soldering flux formulations. Many of these fluxes exhibit improved solderingperformance or are favoured because…
General Principles of Design and Layout (of Printed Board Assemblies)
W. MacLeod Ross, G. LeonidaThis issue of the journalfeatures the second part of a three part series which comprises Chapter 8 from Volume 1 of therecently published book ‘A Comprehensive Guide to the…
Fine‐Line Applications of Ormet® Transient Liquid Phase Sintered Conductive Ink
P. GandhiIn recent years, electronicdevices have increasingly employed printed circuits produced using electrically conductiveadhesives, commonly known as polymer thick films. This method…
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari