Table of contents
Measurement and Control of Coating Thickness and Porosity in Printed Wiring Manufacture: Part III
T.D.T. LatterMost of the basic requirements for the manufacture of printed wiring are, of course, well known; so much so that literally hundreds of companies or divisions of larger companies…
National and International Committees for Printed Wiring: 6—Panel J of the Radio and Electronic Components Manufacturing Federation
P. Antony ClaytonIn this issue of the Journal we continue with our series on National and International Committees by examining the work carried out by Panel J of the Radio and Electronic…
Some Facts and Figures on the Japanese Printed Circuit Industry
In this issue of the Journal we continue with our series of articles describing the current situation of the printed circuit industry in various countries throughout the world and…
Products ♦ Processes ♦ Materials ♦ Equipment
When Fry's Flowsolder Division first decided to design a completely new machine, experienced users of flowsolder machines were invited to list the features which they felt were…
The Uses of Organic Polymers in Electronics Packaging with Particular References to Printed Circuit Modules
W. MacLeod RossIn this paper a review is given of the more commonly employed organic polymers for coating and embedment of electronic modules. Following discussion of the basic types and their…
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari