Table of contents
Electrical Characteristics of Unilayer II A Discrete Wire Alternative to Multilayer PWBs
J.L. GrantAs the speed, density, power dissipation, and overall performance of semiconductor chips continue to improve, electronic equipment designers are finding that their ability to…
The Importance of High Quality Electroless Copper Deposition in the Production of Plated‐through‐hole PCBs
C. LeaFor zero‐defect wave soldering of double‐sided and multilayer printed circuit boards, the copper through‐hole‐plating must be impervious to gas generated in the laminate for the…
Controlling Dimensional Change During Lamination of Multilayer Polyimide Printed Wiring Boards
P.E. HintonRigid multilayer polyimide printed wiring boards exhibit unusually large dimensional change during the lamination process. Therefore, the use of large polyimide multilayer panels…
True Temperature Measurement of Electronic Components Using Infra‐red Thermography
J.M. Kallis, A.H. Samuels, R.P. StoutGreat savings can be achieved by detecting and isolating design problems early in an electronic programme. Many design problems, including electrical overstress, poor thermal…
Economics of Bare Printed Circuit Board Testing
G. HroundasThe increasing complexity of today's Printed Circuit Boards inevitably leads to higher failure rates at the assembled board and product levels. Electrical testing of PCBs at the…
Meeting the Challenges of High Volume PCB Cross‐section Sample Preparation
J.A. Nelson, R. ZimmerThe ever‐increasing need for circuit boards places equally heavy demands on the control laboratory to prepare and examine sufficient polished cross‐sections for process analysis…
Quality Assurance in the PCB Industry‐Incoming Goods Inspection
D.G. WeissThis paper aims to give a survey of incoming inspection of raw materials—an integral part of Quality Assurance in the printed circuit industry—describing some test methods and…
Polymer Thick Films: What Are They, How Are They Used and Where?
C.I. WallThe paper introduces the concept of Polymer Thick Film for low temperature resistor and conductor printing. It describes the materials and their characteristics and outlines some…
On the Utility of Insulation Resistance Tests to Assess the Life Performance of Printed Wiring Boards
E.T. EisenmannBased on new data insulation resistance tests have little capacity to predict the life performance of double‐sided rigid printed wiring boards. This conclusion arises from an…
Blowholes in PCB Soldering Their Causes and Cures
R.B. TurnbullA blowhole is a defect in a soldered joint on a printed circuit assembly which incorporates plated through‐hole circuitry. Blowholes are caused by volatiles being generated in the…
The Glass Transition Temperature and Its Measurement in Epoxy Glass Laminates
C.A. SmithThis paper describes the chemistry and physics of the Glass Transition Temperature (Tg) and how it is measured in epoxy glass laminates using thermochemical techniques. Tg is…
Fujitsu Multilayer Facility—Akashi, Japan
Mid‐June heralding with almost clockwork regularity the onset of the rainy season on Honshu, the main island of Japan, the cloudless sunny day with clear visibility on which…
The Printed Circuit Board Industry in Denmark
Although in Denmark the electronics industry, in its wider context, can be traced back to the early years of this century and had by 1925 developed sufficiently to form a trade…
At the Bottom of the Trough
PCB manufacturers worldwide are anxiously watching for signs of the up turn. In most countries of the Western world there has been some degree of down turn which has varied from…
Productronica '85 12–16 November–Munich
A hasty Bockwurst mit Sauerkraut to provide energy for the afternoon, those well‐earned succulent spare ribs or crisply barbecued Schweinshaxen to sink one's teeth into, yet…
Salon international des composants électroniques 85 PARIS 4–8 novembre
The early timing of the 1985 event, the 27th Salon International des Composants Electroniques, may have left those avid to sample the year's Beaujolais Nouveau a little…
Yates Industries Celebrate 25th Anniversary
The Hotel Vier Jahreszeiten in Munich's Maximilianstrasse proved a very pleasant setting for the cocktail reception and splendid buffet dinner held on 14th November during…
ICT News
Held in the Cameo Room of the Metropole Hotel, Brighton, on the evening of 9th October, the Cahners Gala Awards Dinner sponsored by Electronics Weekly was attended by over 200…
International institute news
The Annual Fall Symposium took place on 11–12 November, 1985, at the Marriott‐LAX Hotel, Los Angeles, focusing on the theme: ‘PC Technology: Materials, Processes and Requirements…
Industry news
Dr B. T. K. Barry has been appointed Director of the International Tin Research Institute with effect from 1 October 1985 following the retirement of Dr D. A. Robins. Dr Barry…
New products
A new three‐layer Floating Annulus Tape Automated Bonding Film (FATAB) material is now available from the Circuit Materials Division of the Rogers Corporation and will be…
ISSN:
0305-6120e-ISSN:
1758-602XISSN-L:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari