Assembly Automation: Volume 17 Issue 1

Incorporating structural adhesives into automated assembly

Jeffrey Boyt Dalling

Claims that, although the use of adhesives in automated assembly is common, the use of structural adhesives is not so. Indeed, the use of structural adhesives can be termed a “new…

Erratum

This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/09540919610777717. When citing the…

The framework for recovery

Brian W. Rooks

Presents a case history of Stoves, a Liverpool‐based domestic cooker manufacturer after its buy‐in management buy‐out. Details how the company achieved success, and turned around…

Ford ‐ Valencia: just in time and just on site

Anna Kochan

Describes the production of Ford’s new small car, the KA, which is being assembled in Valencia, Spain. Makes comparisons between the production of the KA and Ford’s earlier car…

Festo opens new UK automation centre

Brian W. Rooks

Describes the new Applied Automation Centre opened in Northampton by Festo, a pneumatic automation systems manufacturer. Claims that new advances in intelligent pneumatics will…

Opportunities for adhesives and tapes in automated assembly

Paul Corbin

Argues that although adhesives and self‐adhesive tapes are increasingly being used instead of mechanical joining methods, design engineers are still slow to recognize that…

Quality assurance in adhesive joining technology

Heléne Karlsson

Looks at the adhesive‐bonding process, arguing that quality control is generally lacking. Presents a “bonding chain” and goes on to apply quality assurance tools to the…

Joining technologies for the next century: drivers and directions

Robert W. Messler

An ongoing revolution in the development and implementation of new materials has placed new demands on the ability to join these materials into devices, parts and components, and…

Anisotropic conducting adhesives for electronic assembly

David C. Whalley, Samjid H. Mannan, David J. Williams

Presents some experimental and theoretical results from research exploring the design rules and relevant process parameters in the assembly of electronic components using…