Crown teams up with QinetiQ to resolve challenges of RFID on metal packaging

Citation

(2007), "Crown teams up with QinetiQ to resolve challenges of RFID on metal packaging", Sensor Review, Vol. 27 No. 2. https://doi.org/10.1108/sr.2007.08727bab.003

Crown teams up with QinetiQ to resolve challenges of RFID on metal packaging

Crown teams up with QinetiQ to resolve challenges of RFID on metal packaging

Unique solution leverages inherent properties of metal

QinetiQ and Crown Holdings, Inc. have launched a joint development programme to adapt QinetiQ's Omni- ID Pak(tm) integrated RFID technology for use on metal packaging. This will enable brand owners to integrate UHF RFID tags into metal packaging for a wide variety of applications at the single item level.

Designed to mitigate issues such as signal reflection, detuning and grounding which reduce or negate RFID's effectiveness on metal packaging or with aqueous-based products, the unique technology leverages several of metal's inherent properties and shifts the format into an advantageous position.

QinetiQ's standalone Omni-ID Tag(tm) and integrated Omni-ID Pak(tm) technology allows a UHF tag to be mounted directly onto the metal substrate. Measuring substantially less than 1mm in thickness, the unique Omni-ID structure collects and focuses RF energy and enables highly efficient coupling to the chip. Another advantage of the system is that RFID chips require only a short coupling antenna rather than the large dipole usually incorporated in UHF tags, significantly reducing manufacturing costs.

Crown and QinetiQ are continuing development of the technology for metal packaging to further optimize design. In the near future, it is expected that the metal substrate itself will have an integral role in the way the technology functions. Using a beverage or food can as an example, the can itself would serve as the antenna, simplifying production of the RFID tag and further reducing costs. Existing Gen 1 and Gen 2 RFID tags would complete the equation.

“We have utilized our expertise in managing RF signatures and have developed a completely different approach to the construction and operation of passive antenna for RFID applications,” says Tony Kington, General Manager of QinetiQ's Omni- ID business. “By design, this is robust in its functionality and can be incorporated into most common packaging and label media.”

“QinetiQ's Omni-ID technology offers a completely new way to capture energy, making it fundamentally different than other proposed solutions which have been limiting in terms of size, complexity and cost,” comments Dan Abramowicz, President, CROWN Packaging Technology. “With this development, metal has gone from being RFID unfriendly to having powerful benefits that competitive packaging formats do not. Overall costs associated with RFID integration are reduced, the integration process becomes much easier and brand owners have more space on the package itself for graphics and key messaging due to the smaller footprint of the tag.”

Initially, the technology is being targeted at higher end applications such as perfumes, liquors, confections, and ink cartridges. In the longer term, it is anticipated that the technology will be economically feasible at the unit product level for all applications and will be made available for licensing across metal packaging and aqueous product applications.