New miniaturized reflective optical sensor features surface-mount design for space-efficient, high-speed assembly

Sensor Review

ISSN: 0260-2288

Article publication date: 1 March 2002

63

Keywords

Citation

(2002), "New miniaturized reflective optical sensor features surface-mount design for space-efficient, high-speed assembly", Sensor Review, Vol. 22 No. 1. https://doi.org/10.1108/sr.2002.08722aaf.012

Publisher

:

Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited


New miniaturized reflective optical sensor features surface-mount design for space-efficient, high-speed assembly

New miniaturized reflective optical sensor features surface-mount design for space-efficient, high-speed assembly

Keyword: Optical sensor

A new reflective optical sensor that incorporates a miniaturized profile and a surface-mountable design well suited for the high-speed assembly of space-constrained end products has been released by Vishay Intertechnology (NYSE: VSH).

Housed in a package with dimensions of 3.4mm by 2.7 mm and a height profile of just 1.5 mm, the Vishay Telefunken TCNT1000 integrates an infrared emitting light source and a phototransistor detector, positioned side by side to enable the detection of varied materials and objects across a defined distance range. Designed for object detection, the new device is optimized for use in code wheels, shaft encoders, counting or metering systems, copy machines, printers, and fax machines, or any other product that requires the sensing of reflective materials such as paper, IBM cards, or magnetic tape (Plate 14).

Plate 14 New Vishay Telefunken TCNT reflective optical sensors feature a compact 1.5-mm height profile and a surface-mountable design optimized for the high-speed assembly of space-restricted end products

With an operating wavelength of 950 nm, the TCNT1000 is capable of sensing objects within the recommended distance of 1 mm to the sensor. Compatibile with CECC00802 Table 1, Class B or C soldering specification, the device is optimized for the reflow soldering process.

In a market that is placing rising emphasis on the automated construction of increasingly compact products, the demand for components that are compatible with high- precision automated assembly is considerable - and the TCNT1000 meets this demand. As a surface-mountable device delivered in tape and reel packaging, the TCNT1000 is ideal for the high-speed pick and place assembly of even the most compact products.

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