Engineered Material Systems introduces new low-temperature cure die attach

Citation

(2013), "Engineered Material Systems introduces new low-temperature cure die attach", Microelectronics International, Vol. 30 No. 2. https://doi.org/10.1108/mi.2013.21830baa.010

Engineered Material Systems introduces new low-temperature cure die attach

Article Type: New products From: Microelectronics International, Volume 30, Issue 2

Engineered Material Systems introduces its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices. The new electrically conductive die attach adhesive is ideal for smart cards, camera modules, flex circuits and other temperature-sensitive applications.

The 561-50 is more than 90 percent cured after 30 min at 80°C, but has a dispensing work life greater than 48 h (measured as a 25 percent increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability. The 561-50 features extreme flexibility that is ideal for flexible applications with high peel strength to withstand the stresses induced in flexible electronics and display applications. Also, this material can be fast cured at elevated temperatures (1 min at 180°C).

561-50 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the 561-50 Low Temperature Cure Die Attach Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit: www.conductives.com