IMAPS announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2003

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Citation

(2003), "IMAPS announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference", Microelectronics International, Vol. 20 No. 1. https://doi.org/10.1108/mi.2003.21820aab.002

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Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited


IMAPS announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference

IMAPS announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference

Keywords: IMAPS, Ceramics

IMAPS and the Ceramic Interconnect Initiative (CII) has announced the “Ceramic Interconnect Technology: The Next Generation” Conference, scheduled for 8-9 April, 2003 at the Westin Hotel in Denver, Colorado, USA.

Sponsored by IMAPS and the CII, and endorsed by the American Ceramic Society, this expanded 2003 Conference on Ceramic Interconnect Technology will explore leading-edge issues in ceramic interconnect technology, which has a long history of meeting the requirements of the most demanding applications.

The organizing chairs have selected a world wide panel of industry experts to chair sessions for this Conference (see Table I).

In addition, keynote speakers are expected to review technology and applications in areas of high interest, including embedded passives, automotive, microfluidics and MEMS.

Design, simulation and modeling John Gipprich Northrop Grumman
Power and thermal management Dr. Kinzy Jones Florida International University
Portable wireless and bluetooth Dr. Fred Barlow University of Arkansas
Broadband Dr. Jens Mueller University of Erlangen
Fiber optic and electrooptic Dr. Alan Lyons Lucent Corp.
LTCC Dr. Mike Lanagan Penn State University
Materials Dan Amey DuPont Electronic Technologies
Automotive Dr. D. H. Sarma Delphi Automotive
Integrated passives Dr. William Borland DuPont Electronic Technologies
Testing and measurement Mike Janizec NIST
Assembly Paul Collander NOKIA
Base stations George Passiopoulos NOKIA
Military John Roman Consultant
Novel applications Steve Dai Motorola
Ceramic inteconnect markets Rick Sigliano Kyocera Americas

Table I World wide panel of industry experts and their planned sessions

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