IMAPS – Europe Cracow, Poland, 16-18 June 2002

Citation

(2002), "IMAPS – Europe Cracow, Poland, 16-18 June 2002", Microelectronics International, Vol. 19 No. 2. https://doi.org/10.1108/mi.2002.21819bab.001

IMAPS – Europe Cracow, Poland, 16-18 June 2002

IMAPS – Europe Cracow, Poland, 16-18 June 2002

Keyword: IMAPS

Preliminary ProgrammeSunday, 16th June 20021400 – 1730 SEMINARCritical Aspects in Developing Multiple Die AssembliesNational Semiconductor Corporation by Mark Lippold, Mark McClintick and Mike Ehlert

1900 – 2200 Welcome ReceptionMonday, 17th June 2002900 – 915 Opening ceremony

Plenary session I920 – 955 Invited paper 1: The State of Electronic Industry in PolandWieslaw Marciniak – ATV, Warsaw (Poland)955 – 1040 Invited paper 2: Device Packaging in the Year 2020 !Charles Bauer – TechLead Corporation, Evergreen, CO (USA)

1040–1120 Break1120–1320 Parallel Sessions

Session 1:Packaging and Interconnection (Part I)

Session 2:New Materials Thermal Characterization of Flip-Chip Connected SiGe Devices: Experimental Data and Simulations

C. Bassani, F. Grazziani, G.M. Laniu – Alcatel, Vimercate (M) (Italy)

Compliant Photopatternable SiliconesJ. Alger, S. Dent, G. Gardner, B. Harkness, L. Larson, R. Nelson, E. Vanlathem - Dow Corning Europe, Seneffe-Brussels (Belgium)

Flip-Chip Bumping and Redistribution OverviewD. Wojciechowski, E. Blansaer - Alcatel Microelectronics, Oudenaarde (Belgium)

Advantages and New Developments of DBC (Direct Bonded Copper) SubstratesJ. Schulz-Harder - Curamic Electronics, Eschenbach (Germany)

Stress Interposers, the Other Path for Interconnecting Grid-Array Components, or the " Tolerant" and Dismountable ElectronicsM. Massena, P.-J. Albrieux - ALISSON Edition, Palaiseau (France)

Integration Microwave Bandpass Filters Based on High-Temperature Superconducting Films for ExtremeWorking Conditions Korotash, M. Lorenz, E. Rudenko, T. Stepanova - Inst. of Metal Physics, Kyiv and Univ. of Leipzig, Leipzig (Ukraine/ Germany)

Advances in Aligned Wafer Bonding for 3D InterconnectsP. Lindner, J.Weixlberger, V. Dragoi, T. Glinsner, C. Schaefer - EV Group, Schaerding (Austria)

Bumpless Flip Chip Technology Using Copper Lead and Electroplating TechnologyCh.W. Lin, S. Chiang - Bridge Semiconductor Corp, Taipei (Taiwan)

Advanced Wire Bonding for High Frequency DevicesS. Stoukatch, H.H. Meng, K. Vaesen, S. Brebels, W. De Raedt, E. Beyne – IMEC, Leuven (Belgium)

Deposition of Gold Film on Alumina Substrate without Seed Layer for Microwave Integrated CircuitsD. Balasubramanyam, O.P. Kaushik - Space Application Centre, Ahmedabad (India)

Methods for Evaluation of Gravure-Offset Fine-Line Circuitry Printing InksM. Pudas, J. Hagberg, S. Leppävuori, K. Elsey, A. Logan - Univ. of Oulu and Gwent Electronics Materials, Gwent (Finland/UK)

Microwave/mm-Wave Applications: a New Challenge for Ceramic Thick Film TechnologyJ. Cocker, G. Vanrietvelde, E. Polzer, S. Nicotra, J. Müller, A. Brokmeier - DuPont (UK/France/ Germany/Italy)

1320 – 1500 Lunch

Preliminary Programme 21500 – 1620 Parallel Sessions

Session 3:Environmentally-Friendly Electronics

Session 4:Diagnostics, Quality and Reliability (Part I)Lead Free Solder Pastes for Printed and Hybrid Circuits SolderingK. Bukat, D. Rocak, J. Sitek, J. Fajfar-Plut, D. Belavic - Tele and Radio Inst., Warsaw, Jozef Stefan Inst., Ljubljana, HIPOT, Sentjernej (Poland/ Slovenia)Sensors for Products Reliability MonitoringM. Pecht - CALCE Electronic Products and Systems Center, University of Maryland (USA)Wetting Balance Evaluations of the Solderability of Lead-Free SoldersS.M. Adams, Ch. Hunt - BOC Gases, New Providence, National Physical Laboratory, Materials Science, Teddington (USA/UK)Dimensional Control of High Density Interconnect (HDI) Packagingby Means of Confocal Measurement TechniqueR. Brodmann, R. Liebe, F. Gilbert, P. Kracik - NanoFocus AG, Ettlingen, (Germany)Impact of Environmental Regulations on Electronics Manufacture, Use, and DisposalJi Wu, R. Ciocci, M. Pecht, A. Picard - CALCE Electronic Products and Systems Center, University of Maryland, (USA)Electric Force Microscopy Investigation of the Microstructure of Thick Film ResistorsA. Alessandrini, G. Valdre, B. Morten, M. Prudenziati - INFM and Electron Microscopy Centra, Bologna and Modena (Italy)Study on Green Product Reliability for BT Substrate Base CSP (Chip Scale Package)C.L. Chung, C. S. His, S.L. Fu, S. Chou, S. Lin, R.B. Tsai, M.L. Huang, P. Ku I-Shou Univ., Kaohsiung, ChipMOS TECHOLOGIES INC., Tainan, (Taiwan)Thermal Characterisation of Packages by Inverse HeatingG. De Mey, P. Kawka - University of Ghent, Ghent (Belgium)

1620 – 1650 Coffee Break1650 – 1830 Parallel Sessions

Session 5:Assembly Technologies (Part I)

Session 6:Diagnostics, Quality and Reliability (Part II)The Influence of Overheating, Flux and Solder Type on Wettability of Lead-free SoldersR. Kisiel - Warsaw Univ. of Technology, (Poland)

Parameter Study for the Reliability of Underfilled Flip Chip and CSP AssembliesB. Vandevelde, D. Degryse, E. Beyne – IMEC, Leuven (Belgium)

Solder Joint Study by Scanning Acoustic Microscopy (SAM) for RF Power Amplifier CarrierF. Weng, P. Ronkainen, P. Pajala, P. Valiamaki - NokiaNetworks, Oulu (Finland)

In-Process Verification of MLC SubstratesJ. Müller, J. Klein, J. Rayho, K. DiGravio, J. Paumi - Micro Systems Eng., Berg and MIDAS Vision system, Foxboro, (Germany/USA)

A Measurement Technique for Stencil Printed or Dispensed Solder PasteM. Dušek, Ch. Hunt - National Physical Laboratory, Materials Science, Teddington (UK)

Technological Evaluation and Reliability of UV Laser MicroviaH. Hackiewicz, G. Koziol, E. Malczynska-Paz - Tele and Radio Research Institute, Warsaw (Poland)

Evaluation of Soldering Properties of Silver Conductor Pads on LTCC Structures Using SelectedLead-free Solders A. Bochenek, B. Bober - Wroclaw Univ. of Technol., Wroclaw (Poland)

Microelectronics Assembly Innovations, Based on Capillary Connection (C2) for Assembly FabsA. Taran, V. Krivoshapko - Microelectronics Assembly Innovations, Moscow (Russia)

Reliability of Solder Joints in LTCC/PCB AssembliesR. Rautioaho, O. Nousiainen, S. Leppävuori, J. Vahakangas - Univ. of Oulu, Oulu, Finland

1930 - 2400 Gala DinnerPreliminary Programme 3

Tuesday, 18th June 2002Plenary session II900 – 940 Invited paper 3: Trends in Wireless/ RF/Optoelectronic Integrated Packaging,Greg Caswell – International Wireless Packaging Consortium, Round Rock, TX (USA)940 – 1000 Invited paper 4: Electrical Properties of Adhesive Joints,Jan Felba Wroclaw - Univ. of Technology, Wroclaw, (Poland)

1005 – 1145 Parallel Sessions

Session 7:Assembly Technologies (Part II)

Session 8:Passive components, Sensors, MEMS (Part I) Rheological characterization and Multi-Scale Computa-tional Simulations of Electrically Conductive Adhesive FlowsG.P. Glinski, C. Bailey, R. Durairaj, N.N. EkereUniv. of Greenwich, London and Univ. of Salford, (UK)

Laser Treatment of LTCC for 3D Structures and ElementsJ. Kita, A. Dziedzic, L.J. Golonka, T. Zawada - WroclawUniv. of Technology, Wroclaw (Poland)

Solder Alternatives: Conductive Adhesives with Stable Contact Resistance and Improved Mechanical PerformanceG. Dreezen, G.Luyckx - Emerson & Curing, Westerlo (Belgium)

Using LTCC for MicrosystemsT. Theleman, H. Thust, M. Hintz - Technical University of Ilmenau, Ilmenau (Germany)

PC 3000 – The New Generation of IsotropicConductive Adhesives H.-W. Hagedorn, J. Neumann- Rodekirch - W.C. Heraeus, Hanau, (Germany)

On the Zero Offset Stability of Thick Film Strain GaugesJ. Atkinson, Y. Zheng, R. Sion Univ. of Southampton, Southampton and C-Cubed Ltd., St. Mary Bourne (UK)

High Density Flip Chip with Adhesives on CeramicsB. Vandecasteele, T. Podprocky, J. Vanflateren - IMEC/Intec/TFCG, Gent (Belgium)

Design Optimization of an Eddy Current Sensor Using the Finite-Elements MethodJ. Wilde, Y. Lai - IMTEK, University of Freiburg (Germany)

Recent Developments in Anisotropic Conductive Films for Flip Chip Interconnection Based on Z-axis ConductorsA. Gasse, J.-Ch. Souriau, C. Rossat, P. Renard, G. Poupon - CEA-LETI, Grenoble (France)

Effect of -Radiation onto the Properties of TeO2 Thin FilmsK. Arshak, O. Kostrynska - University of Limerick, Limerick (Ireland)

1145 – 1315 Coffee + Poster Session + Exhibition1315 – 1430 Lunch1430 – 1610 Parallel Sessions

Session 9:Packaging and Interconnection (Part II)

Session 10:Passive components, Sensors, MEMS (Part II) Ultra Thin IC PackageE. Janssen, K. Slob, J. van Delft, R. Vranken, Co van Veen - Philips Center for Industrial Technology, Eidhoven (The Netherlands)

Low Temperature Co-Fired Ceramic Packages for HighFrequency and Digital ApplicationsL. Chai, A. Shaikh, V. Stygar - Ferro Electronic Materials (USA)

A Ceramic BGA148 Package for Assembly of a 2 Gsps Analog to Digital ConverterB. Dervaux, F. Bore, O. Gaillard - ATMEL, Grenoble (France)

High Density Packaging Technology for PressureSensor Applications M. Pavlin, D. Belavic, M. Santo Zarnik, M. Hrovat - HIPOT-R&D, Sentjernej and Jozef Stefan Inst., Ljubljana (Slovenia)

The Influence of Packaging Materials on RF PerformanceA. Chandrasekhar, S. Brebels, S. Stoukatch, E. Beyne, W. De Raedt, B. Nauwelaers – IMEC, Leuven (Belgium)

Fodel Microresistors – Processing and Basic Electrical PropertiesA. Dziedzic, L. Rebenklau, L.J. Golonka, K.-J. Wolter - Wroclaw Univ of Technol., Wroclaw and Dresden Univ of Technol, Dresden (Poland/ Germany)

Taiwan Packaging StatusS.-L. Fu, S.H. Huang, E. Wu - I-Shou University, Taiwan ERSO, ITRI and National Taiwan University (Taiwan)

RF On-Chip Passive Components Fabricated by CMOS Compatible Cu Interconnect TechnologyG. Lihui, Y. Mingbin, Ch. Zhen, Z. Yi, N. Loke, L. Chaoyong, Y. Bo - Inst. of Microelectronics (Singapore)

The Packaging of ICs: A New ApproachV.I. Rudakov - Inst. of Microelectronics and Informatics RAS, Yaroslavl (Russia)

Spiral Inductors in Multi-Layer Thin-Film MCM-DG. Carchon, S. Brebels, K. Vaesen, W. De Raedt, E. Beyne – IMEC, Leuven (Belgium)

Preliminary Programme 41610 – 1750 Parallel Sessions

Session 11:Applications

Session 12:Design, Modelling and Simulation

2002 High Density Microelectronics Roadmap for Space ApplicationsL. Galbraith - Jet Propulsion Laboratory, California Institute of Technology, NASA, Pasadena (USA)

Multiobjective Optimal Design of Printed Wiring Boards with Forced Air CoolingQ. Li, O.A. Palusinski - University of Arizona, Tuscon (USA)

Understanding the "Immunity level" and "EM Compati-bility" of Electronic Packaging with Embedded EMI ShieldingS. Oggioni, M. Spreafico - IBM Italy, Vimercate (Italy)

Effects of Misalignment on Reliability of Flip-Chip Solder Joints by FEMJ. Valtanen, P. Heino, E. Ristolainen - Institute ofElectronics, Tampere University of Technology (Finland)

Thermal Optimization of Miniaturized Camera and Pentium PC ModuleZ. Stossel, F. Vogel, R. Kothe - Univ. of Applied Sciences of Central Switzerland, Horw (Switzerland)

Future Design Concept for Motorola Smart ConnectorA. Schaller, A. Kolbeck, H. Wieser, T. Hauck, M. Riess - Motorola, Wiesbaden (Germany)

Realisation of Narrow Conductor Lines in LTCC Modules by Etching TechniqueM. Lahti - VTT Electronics, Oulu (Finland)

Investigation of Coplanar Ground Inductor Design and Performance on LaminatesS.L. Cheah, M. Rotaru - Institute of Microelectronics (Singapore)

A Radio Listener Research System in a WristwatchA. Kieser - Hochschule fur Technik, Luzern (Switzerland)

Numerical Stable Green' s Function Approach for Admittance Components Calculation of Multiple Coupled On-Chip InterconnectsH. Ymeri, B. Nauwelaers, K. Maex, S. Vandenberghe, D. de Roest – IMEC, Leuven (Belgium)

1750 Closing Ceremony