Citation
(2002), "IMAPS-UK AGM 17:30 in the Stanley Suite", Microelectronics International, Vol. 19 No. 1. https://doi.org/10.1108/mi.2002.21819aab.002
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
IMAPS-UK AGM 17:30 in the Stanley Suite
Wednesday 30 January 2002
Session 3A: PACKAGING AND ENCAPSULATION – Stanley Suite
1000 – 1030 Investigation Into The Solderability of Sn/Ag/Cu Pb – Free Solder Paste Used for Flip Chip Geometry – G Jackson, Salford University
1035 – 1105 Combined Experimental and Computational Modelling Approach To The Investigation of Solder Joint Formation in Fine Pitch Flip Chip Assemblies – M Hendriksen, Celestica Limited
1105 – 1130 Coffee & Exhibition
1130 – 1200 Phase Change Materials for Thermal Management – T De'Ath, HLA
1205 – 1235 UV-LIGA Based Stencils – R Kay, Heriot Watt University
Session 3B: MEMS and Special Applications – Lancaster Suite
1000 – 1030 High K Low Loss Dielectrics Co-Fireable with LTCC – Q Reynolds, Heraeus Materials Limited
1035 – 1105 Integrated Capacitors on LTCC – J Mueller, Microsystems Engineering
1105 – 1130 Coffee & Exhibition
1130 – 1200 Europractice EASIT – University of Bordeaux
1205 – 1235 Electromagnetically Compatible Microelectronics Packaging (EMCEM) – FN Sinnadurai, Bookham Technology
1235 – 1345 Lunch & Exhibition – Alexandra Suite
Session 4: Market Watch – Stanley Suite
1400 – 1600 MARKET WATCH SESSION – Panel Discussion with Key Industrialists from UK and Europe
Introductory Paper – Packaging Roadmaps for MEMS & Microsystems Technology – M Wilkinson, Technology For Industry