Keywords
Citation
(2002), "MicroTech 2002 Programme", Microelectronics International, Vol. 19 No. 1. https://doi.org/10.1108/mi.2002.21819aab.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
MicroTech 2002 Programme
Keyword: IMAPS
MicroTech 2002 will be held on Tuesday 29th and Wednesday 30th January 2002 at the Crowne Plaza (The Midland) Hotel, Manchester.
Tuesday 29 January 2002
Session 1A: Packaging and Encapsulation – Stanley Suite
0915 – 1025 Welcome and Exhibitor Presentations
1030 – 1100 No Flow Fluxing Underfill Encapsulants Process Characterisation – Jim Mulley Emerson & Cuming
1105 – 1135 No Flow Underfill Additional Reliability Data And Failure Mode – Peter Ongley – Cookson SemiConductor Packaging
1135 – 1150 Coffee & Exhibition
1150 – 1220 Next Generation Fast Flow Snap Cure Underfills For Fine Pitch Flip Chip – L Crane Loctite
1225 – 1255 Anisotropic Conductive Materials As Underfills – D Lowrie HLA
Session 1B: MEMS and Special Applications – Lancaster Suite
1030 – 1100 European MEMS Foundry Services – C Gahn, Bosch
1105 – 1135 Micro-system Assembly Technology for 21st Century – C Bailey, Greenwich University
1135 – 1150 Coffee & Exhibition
1150 – 1220 High Volume Production Of Thick Film Hybrids For Automotive Under Hood Applications – P Wilczek, AB Microelektronik
1225 – 1255 Characterisation Of Thick Film Resistors On Zirconia Substrates For Possible Applications – M Hrovat, Josef Stefan Institute
Lunch and Exhibition
1300 – 1430 – Alexandra Suite
Session 2A: Packaging and Encapsulation – Stanley Suite
1430 – 1500 econdary Lead Free BGA Rework: Effect On Joint Microstructure & Intermetallic Compound Formation – R Horsley, Celestica Ltd
1505 – 1535 Reliability Aspects Of Lead Free Soldered Components On Ceramic Substrates – K Williams, Kingston University
1535 – 1600 Coffee & Exhibition
1605 – 1635 A Test Methodology For Assessing Pb – Free Solder Joint Reliability – C Hunt, NPL
1640 – 1710 Electronics And Nature Can Be Compatible (ENABLE) – Nihal Sinnadurai, Bookham Technology
Session 2B: MEMS and Special Applications – Lancaster Suite
1430 – 1500 Electrical Characterisation of BGA Package for RF Applications – A Chandreskhar,
IMEC
1505 – 1535 Chip Assembly using SBB for High Frequency GaAs Modules – S Stoukatch,
IMEC
1535 – 1600 Coffee & Exhibition
1605 – 1635 The Problems Associated With Making 3D Electrical Connections In Microsystems – D Hodgins, European Technology For Business
1640 – 1710 A Quest for the perfect Microphone Pre-Amplifier – M Meecham, Encoda Systems