Citation
(2001), "IMAPS USA. IMAPS 2001 heating up; Photonics, Flip Chip, Microwave, tracks are popular symposium topics", Microelectronics International, Vol. 18 No. 2. https://doi.org/10.1108/mi.2001.21818bab.007
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
IMAPS USA. IMAPS 2001 heating up; Photonics, Flip Chip, Microwave, tracks are popular symposium topics
IMAPS USA
IMAPS 2001 heating up; Photonics, Flip Chip, Microwave, tracks are popular symposium topics
IMAPS 2001, way ahead in booth space sales over IMAPS 2000 at the same time last year, has also drawn in over 200 technical paper submissions on hot current topics that include: Photonics, Flip Chip, BGA, Microwave, Embedded passives, Materials, Wire bonding, MEMS, MOEMS, and more. IMAPS 2001, The 34th International Symposium on Microelectronics, is sponsored by the International Microelectronics and Packaging Society (IMAPS). IMAPS 2001 takes place this coming 9-11 October 2001 at the Baltimore Convention Center, Baltimore, MD USA.
Advances in wireless communications technologies, Optoelectronics, Microwave, new approaches in ceramic interconnect technologies, and more are driving new tracks in this year's robust Technical Program and Symposium, with 23 Professional Development Courses (seven new) and 17 full sessions in the symposium of seven papers each, and four half-sessions of three papers each. A Plenary Session and briskly-selling exhibitor booth spaces round out expectations for a successful show, according to John Graves, General Chair for IMAPS 2001. "IMAPS 2001 offers a powerful technical program, progressive professional development courses, and many forums for industry professionals to share the latest developments in microelectronics," he stated.
Further details: www.imaps.org/imaps2001