Loctite introduces thermal shock resistant epoxy potting compound

Citation

(2000), "Loctite introduces thermal shock resistant epoxy potting compound", Microelectronics International, Vol. 17 No. 3. https://doi.org/10.1108/mi.2000.21817cad.014

Loctite introduces thermal shock resistant epoxy potting compound

Loctite introduces thermal shock resistant epoxy potting compound

Keywords Loctite, Epoxy

Loctite Corporation has introduced a new medium viscosity, thermally conductive epoxy potting compound, Loctite 3862, for electronic applications that require thermal shock resistance and thermal conductivity.

Loctite 3862 (Plate 6) is a heat curable potting material that offers low thermal expansion, excellent wetting and flow capabilities, high heat transfer capabilities, and outstanding electrical properties. This versatile potting material cures fully when exposed to 100°C temperatures for two hours, or to 180°C temperatures for one hour. Since it is highly resistant to weather, water, gases and vapors, petroleum lubricants, and many mild acids and alkalis, Loctite 3862 is an ideal choice for harsh end use applications such as automotive environments. The product is also suitable for Military Class H applications.

Plate 6 Loctite 3862 epoxy potting compound

For more information on Loctite 3862, call 1-800-LOCTITE or visit the Loctite Web site at: www.loctite.com