MicroJoin introduces new extended-length Ceramic Hot Bar Technology(TM) (CHBT(TM))

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2000

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Keywords

Citation

(2000), "MicroJoin introduces new extended-length Ceramic Hot Bar Technology(TM) (CHBT(TM))", Microelectronics International, Vol. 17 No. 3. https://doi.org/10.1108/mi.2000.21817cad.012

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


MicroJoin introduces new extended-length Ceramic Hot Bar Technology(TM) (CHBT(TM))

MicroJoin introduces new extended-length Ceramic Hot Bar TechnologyTM (CHBTTM)

Keywords MicroJoin, Hot bar, Ceramics

MicroJoin (formerly Hughes and Palomar Technologies) has further expanded the productivity potential and deployment flexibility of its proven industry leading Ceramic Hot Bar TechnologyTM by introducing new extended-length CHBTTM devices of up to 200mm long (Plate 4). While conventional metal hot bars are impractical for precision bonding at lengths beyond 3" (76mm), MicroJoin's patented CHBT hot bars have already been successfully deployed for precision production bonding operations in lengths of more than 6.5" (165mm). The new extended length CHBT configurations of up to 7.88" (200mm) provide even more flexibility for performing large bonding jobs in a single pass or bonding multiple connections simultaneously.

Plate 4 Extended length Ceramic Hot Bar Technology devices now available from MicroJoin

Owing to its superior coplanarity and uniform thermal characteristics, CHBT has proven to be the optimal solution for achieving consistent high quality yields from precision Anisotropic Conductive Film (ACF) and Heat Seal Connector (HSC) processes used in the manufacture of Flat Panel Displays, handheld devices, avionics, and other electronic assemblies. When compared to conventional metal hot bars, CHBT ceramic hot bars deliver superior performance in all of the critical attributes, including flatness, thermal conduction and electrical isolation. Ceramic's lower Thermal Coefficient of Expansion (TCE) means less distortion and its inherently flat crystalline structure optimizes coplanarity and thermal conduction, even across lengths of 200mm and longer.

In addition to providing superior flatness and thermal consistency across a longer span, the CHBT can also be custom configured with cut-out notches to accommodate intervening components at heights of up to 0.25 inches, without any loss of bonding consistency. This gives manufacturers the flexibility to work around existing components while still maintaining the high through-put of a single bonding pass, thereby easily accommodating either larger and more complex assemblies or the option to bond multiple smaller assemblies at the same time.

The extended-length CHBT hot bars can be used on any of MicroJoin's Model 2000 or Model 4000 series of bonding systems and provide full compatibility with the full range of embedded-thermocouple feedback and process control mechanisms.

For more information please contact: Kathleen Prestera, Marketing Communications Specialist. Tel: (858) 877 2100; E-mail: communications@microjoin.com

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