Datacon continues to grow – preparations begin for second expansion within two years

Citation

(2000), "Datacon continues to grow – preparations begin for second expansion within two years", Microelectronics International, Vol. 17 No. 3. https://doi.org/10.1108/mi.2000.21817cab.025

Datacon continues to grow – preparations begin for second expansion within two years

Datacon continues to grow – preparations begin for second expansion within two years

Keywords Datacon, Growth

Datacon, a leading European die bond manufacturer, is set to expand again, just 12 months after the completion of its new 6,000m² production facility. A ground-breaking ceremony for the planned 3,600m² extension, designed to house a new development lab and further office and production space, took place in May with completion scheduled for December this year.

Since the opening of the original facility last year, the workforce has grown from 130 to 220 employees, in line with an anticipated sales increase this year of over 75 per cent.

"One of the reasons for this is our breakthrough in the Asian market. The largest subcontractor of Asia's semiconductor industry, for example, placed an order valued at over US$4 million. And that's just one example of many", explains Helmut Rutterschmidt, managing director of Datacon Semiconductor Equipment GmbH.

The new building represents an investment by Datacon of approximately 3.3 million Euros.