MicroJoin introduces the 4200 PDI pulsed heat hot bar bonder with powered display inspection

Citation

(1999), "MicroJoin introduces the 4200 PDI pulsed heat hot bar bonder with powered display inspection", Microelectronics International, Vol. 16 No. 3. https://doi.org/10.1108/mi.1999.21816cad.005

MicroJoin introduces the 4200 PDI pulsed heat hot bar bonder with powered display inspection

MicroJoin introduces the 4200 PDI pulsed heat hot bar bonder with powered display inspection

Keywords MicroJoin, Bonding, Inspection

MicroJoin, Inc., a subsidiary of Palomar Technologies, Inc., introduces its new 4200 PDI pulsed heat hot bar bonder (Plate 3) for attaching and automatically testing displays in applications such as wireless phones and other hand-held products. The system uses a personal computer to control and monitor the bonding process with easy-to-use software, resulting in a system that facilitates consistently accurate, high quality bonds. Pattern recognition software and optical inspection are incorporated into the system to exercise each pixel of a display and record any failures in seconds. The bonder attaches two displays with a heat seal or solder reflow hot bar process while simultaneously powering up and testing two assemblies in the load/unload position.

With MicroJoin's pulsed heat hot bar bonder, the inspection process runs parallel with the bonding process to increase through-put, automatically inspecting the display after bonding. A variety of defects are displayed, such as pixel anomalies, missing rows or columns, and poor quality or missing icons, text or backlight. The robust inspection process works with both backlit and non-backlit LCDs and displays with protective film. Display test results are logged and bit-maps of failed displays are saved to disk with date/time, yield ratio and serial number data. In-line process control features include: analysis of embedded product data prior to bonding; sending custom serial data to tested product upon pass/fail; and reading electronic serial numbers (ESN).

Easy operator controls, such as menu selection of operations, on-screen status messages, built-in system diagnostics and real-time graphical display of command and measure data are part of the 4200 PDI system. Process control features are consistent with ISO 9000 requirements. The system software monitors and records all bonding parameters every 0.1 second.

Plate 34200 PDI pulsed heat hot bar border

MicroJoin's bonding system utilizes its patented ceramic hot bars, providing even temperature across the bars while maintaining shape and lead force during bonding. The 4200 PDI meets MIL-STD-2000 voltage requirements with no damaging voltage on sensitive parts. Ceramic hot bars can be made in virtually any length or width to fit exact customer requirements. Custom tooling can be developed for fast production line integration. Systems come in stand-alone semi-automatic or conveyor compatible configurations.

For further information please contact: Micro Join, Inc., Kathleen Prestera. Tel: +1 (619) 877 2100; Fax: +1 (619) 877 2110; E-mail: communications@microjoin.com