Siemens to commercialize PSGA packaging technology

Citation

(1999), "Siemens to commercialize PSGA packaging technology", Microelectronics International, Vol. 16 No. 1. https://doi.org/10.1108/mi.1999.21816aad.014

Siemens to commercialize PSGA packaging technology

Siemens to commercialize PSGA packaging technology

Keywords IMEC, Packaging, Siemens

Siemens have announced the commercialisation of a new electronics packaging format called a Polymer Stud Grid Array Package (PSGA), following development work in collaboration with IMEC, European centre for microelectronics research.

The PSGA is a single moulded substrate of metallised plastic with studs protruding from the substrate body for connection between the package and the PCB board with either solder or glue. This is in contrast to the BGA (ball grid array) package which uses solder balls for the interconnection.

PSGAs were originally conceived by Siemens Corporate Research in response to recent packaging trends emphasising area array connections and chip scale packages for large pin-count ICs, as well as lower costs, higher reliability and smaller package dimensions. This new package's simple design and more rugged construction makes it suitable for assembly in high-density arrays on printed circuit boards, primarily on those with patterning realised by a new Siemens laser direct write technique. PSGAs also have excellent electrical, thermal and thermo-mechanical performance.

For further information please contact Marianne Van den Broeck, IMEC, Kapeldreef 75, B-3001 Leuven, Belgium. Tel: 32 162811491; Fax: 32 1628 1637; Email: marianne@imec.be web: www.imec.be