Keywords
Citation
(1999), "Holometrix and Micromet Instruments join to support the electronic thermal management and packaging materials market", Microelectronics International, Vol. 16 No. 1. https://doi.org/10.1108/mi.1999.21816aad.002
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
Holometrix and Micromet Instruments join to support the electronic thermal management and packaging materials market
Holometrix and Micromet Instruments join to support the electronic thermal management and packaging materials market
Keywords Holometrix, Micromet, Semiconductors
Metrisa Inc. has combined the operations of Holometrix and Micromet Instruments. The Holometrix-Micromet Division will operate as a separate profit center within Metrisa. Micromet Instruments was acquired in February of 1998.
Holometrix and Micromet serve the semiconductor and electronics packaging material development and processing industries. Holometrix provides instruments and testing services for measuring the thermal properties of thermal management materials. Micromet provides systems for cure monitoring of polymers, composites, encapsulants and films used in electronic, aerospace, automotive and molding applications.