Citation
Rigelsford, J. (2002), "Wafer processing apparatus and method", Industrial Robot, Vol. 29 No. 4. https://doi.org/10.1108/ir.2002.04929dad.008
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Wafer processing apparatus and method
Wafer processing apparatus and method
Applicant: Yanagita Kazutaka and Sakaguchi KiyofumiPatent number: US2002013065Publication date: 31 January 2002Title: Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
This invention relates to a wafer processing apparatus and method, a wafer convey robot, a semiconductor substrate fabrication method, and a semiconductor fabrication apparatus. The method describes a process in which a wafer is dipped into a processing solution by a suitable wafer conveyor robot. A typical example of such a process is wet etching. It is an objective of the invention to prevent contamination of a wafer caused by particles.