Adhesiveless Flexible Copper‐polyimide Thin Film Laminates

Abstract

For TAB tapes and flex circuitry, laminates with adhesives (3‐layer laminates) are commonly used. The drawbacks of adhesives are well known. Adhesiveless flexible copper‐polyimide laminates (2‐layer laminates) could avoid such disadvantages. Two‐layer thin film laminates may be produced using sputtering technology. Good adhesion strength between the copper and the polyimide film may be achieved by means of special plasma treatment. The advantages and disadvantages of 2‐layer flexible thin film laminates are discussed in this paper, along with their different production methods. The adhesion strength of 2‐layer laminates in comparison with 3‐layer laminates will be pointed out. Future uses of 2‐layer flexible thin film laminates will be considered, along with their benefits.

Citation

Fronz, V. (1991), "Adhesiveless Flexible Copper‐polyimide Thin Film Laminates", Circuit World, Vol. 17 No. 4, pp. 15-18. https://doi.org/10.1108/eb046142