Multichip Modules for Advanced Applications

Abstract

This paper discusses the increasing activity being directed towards microminiature multichip module packaging. It shows new substrate materials that are being investigated, including multilayer thin‐film ceramics and silicon wafers. Wire bonding, tape‐automated bonding (TAB), and flip device termination techniques are covered. Particular attention is given to the use of multichip modules for advanced data processing applications.

Citation

Ginsberg, G.L. (1990), "Multichip Modules for Advanced Applications", Circuit World, Vol. 17 No. 1, pp. 5-9. https://doi.org/10.1108/eb046106