The Pink Ring Condition in Multilayer PCBs: An industrial collaborative research programme

Abstract

Pink ring is a ubiquitous problem arising during the manufacture of multilayer PCBs, being the manifestation of local delamination at the inner‐layer oxide interfaces around drilled holes and subsequent dissolution of the oxide during plating processes. Except in extreme cases, there is no evidence that the occurrence of pink ring identifies any in‐service reliability problem, but it is nevertheless a clear process indicator and is strictly monitored in statistical process control. The UK Printed Circuit Industry has carried out a collaborative research programme aimed at providing an understanding and a quantitative analysis of the pink ring condition. The research has advanced on two fronts: (i) an investigation into the micro‐mechanisms of the delamination and stress relief around drilled holes and subsequent rôles of the desmear and plating chemicals, and (ii) a statistical analysis of boards manufactured in a variety of ways, analysing the quantitative measurements of pink ring in terms of, for example, panel source, drill supplier, drill quality, drilling backing material, drilling chip rate, stack position, and panel entry/exit side.

Citation

Graham, S., Hanson, A., Hattam, M., Jennison, L., Jordan, M., Klein, G., Lang, I., Lea, C., Moffat, C., Newlands, M., Streets, P., Tilbrook, D., Wallace, D., Wisnosky, M. and Wylie, I. (1990), "The Pink Ring Condition in Multilayer PCBs: An industrial collaborative research programme", Circuit World, Vol. 16 No. 4, pp. 4-12. https://doi.org/10.1108/eb046092