Providing Solderability Retention by means of Chemical Inhibitors

Abstract

Protective cover coating of bare copper boards is necessary to resist long‐term storage. Both water‐soluble and rosin‐based fluxes are used in the evaluation. The inhibitors have been practically tested on coupons which were soldered after accelerated ageing tests. All investigations were carried out with respect to the impact on waste treatment, and the adjustment to various fluxes.

Citation

Bakszt, M. (1985), "Providing Solderability Retention by means of Chemical Inhibitors", Circuit World, Vol. 11 No. 2, pp. 14-17. https://doi.org/10.1108/eb045985