Characterisation of Die Attach Adhesives

Abstract

Several commercially available epoxy and polyimide adhesives were tested. The properties essential for the use of adhesives in microelectronics are stated and their compliance with the requirements of standard MIL‐A‐87‐172 was evaluated.

Citation

Remškar, M. and Ročak, D. (1989), "Characterisation of Die Attach Adhesives", Microelectronics International, Vol. 6 No. 3, pp. 14-17. https://doi.org/10.1108/eb044383