Multichip Technology—Something for everyone?
Abstract
Each of the three major branches of interconnection technology has begun to focus its attention on Multichip Modules. The semiconductor manufacturers call the technology ‘The New Wafer Scale’ and use silicon‐on‐silicon constructions, but use organic insulating layers on the mother slice, permitting copper conductors instead of aluminium as used for the older silicon dioxide as the insulating material.
Citation
Balde, J. (1988), "Multichip Technology—Something for everyone?", Microelectronics International, Vol. 5 No. 3, pp. 2-3. https://doi.org/10.1108/eb044331
Publisher
:MCB UP Ltd
Copyright © 1988, MCB UP Limited