To read this content please select one of the options below:

(excl. tax) 30 days to view and download

Notes on the Effects of Metallisation of Surface Mounted Components on Soldering

R.J. Klein Wassink

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1987

42

Abstract

Some characteristics of the metallisation of leadless ceramic components are discussed, such as dissolution, reliability of joints, intermetallic compound formations and the migration of silver. It is concluded that it is not the type of the metallisation that is important, but the quality of the make.

Citation

Klein Wassink, R.J. (1987), "Notes on the Effects of Metallisation of Surface Mounted Components on Soldering", Microelectronics International, Vol. 4 No. 2, pp. 9-12. https://doi.org/10.1108/eb044269

Publisher

:

MCB UP Ltd

Copyright © 1987, MCB UP Limited

Related articles