A Unique Way of Placing Via Hole Connections in the SMD Pads Gives Increased Routing Space on Printed Circuit Boards

Abstract

Via holes in SMD solder pads normally disturb the flow of the solder during soldering. To avoid this, expensive processes whereby the holes are filled with solder cream are used by the assembler. The paper describes a technique which allows the designer to design ‘Vias in SMD Solder Pads’ and so gain additional routing space on the printed boards, yet maintaining good solderability, using standard soldering processes.

Citation

Braun, R. (1990), "A Unique Way of Placing Via Hole Connections in the SMD Pads Gives Increased Routing Space on Printed Circuit Boards", Circuit World, Vol. 16 No. 2, pp. 45-46. https://doi.org/10.1108/eb044023