Three‐dimensional Moulded Printed Circuits

Abstract

The three‐dimensional moulded printed circuit board is no longer just a concept, but a vehicle ready to exploit the challenges of highly integrated and miniaturised electronic packages. Several types of technology now exist which enable circuitry to be built on three‐dimensional structures in varying degrees of complexity. This article is intended to review the developments of injection moulded printed circuit boards, some of the key advantages over conventional FR‐4 boards, the various processes and techniques involved in the 3‐D technologies, and finally to describe the most recent advancement, using a robotic laser technique.

Citation

Whelan, M. (1990), "Three‐dimensional Moulded Printed Circuits", Circuit World, Vol. 16 No. 2, pp. 25-29. https://doi.org/10.1108/eb044018