Inner Layer or Post Cracking on Multilayer Printed Circuit Boards

Abstract

The possible causes of inner layer junction cracks on multilayer PCBs are discussed and the problems that cracks can cause under rework conditions. The procedure to identify the cracks and their exact location within and around the electroless copper junction is shown, along with guidelines on the possible ways to eliminate the cracking problem and on testing procedures to ensure a reliable product.

Citation

Gray, M.W. (1989), "Inner Layer or Post Cracking on Multilayer Printed Circuit Boards", Circuit World, Vol. 15 No. 2, pp. 22-29. https://doi.org/10.1108/eb043969