Automated Edge Connector Plating Equipment for Printed Circuit Boards
Abstract
This paper describes the development of a new generation automated edge connector plating system specifically concerned with the even distribution of precious metal on the connector surfaces. Other aspects include the minimisation of process chemical contamination through the development of special interstage sealing methodology, and the introduction of high speed process chemical technology.
Citation
Hemsley, J.D.C. (1988), "Automated Edge Connector Plating Equipment for Printed Circuit Boards", Circuit World, Vol. 14 No. 2, pp. 39-41. https://doi.org/10.1108/eb043952
Publisher
:MCB UP Ltd
Copyright © 1988, MCB UP Limited