New products

Abstract

Engelhard have introduced a pure palladium electroplating process called ‘Palltronic’. The ‘Palltronic’ process produces deposits that are significantly more ductile than those from other pure palladium processes. It is specifically designed for high‐speed plating of connectors, contacts, printed circuit boards and other electronic components and can be used as a substitute for gold in nearly all of these applications.

Citation

(1987), "New products", Circuit World, Vol. 13 No. 4, pp. 77-80. https://doi.org/10.1108/eb043928